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| SEMICONDUCTOR TECHNICAL DATA GENERAL DESCRIPTION This Trench MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristiscs. It is mainly suitable for DC/DC Converter and Battery pack.. D P KU063N03Q www..com N-Ch Trench MOSFET H T G L FEATURES VDSS=30V, ID=16A. Drain to Source On Resistance. RDS(ON)=6.3m (Max.) @ VGS=10V RDS(ON)=10.7m (Max.) @ VGS=4.5V 8 A 5 B1 B2 1 4 MOSFET Maximum Ratings (Ta=25 CHARACTERISTIC Drain to Source Voltage Gate to Source Voltage Drain Current Drain Power Dissipation DC@Ta=25 Pulsed @Ta=25 Unless otherwise noted) SYMBOL RATING VDSS VGSS (Note 1) ID IDP (Note 1) PD Tj Tstg (Note 1) RthJA 30 20 16 64 2.5 150 -55~150 50 /W UNIT V V A A W DIM A B1 B2 D G H L P T MILLIMETERS _ 4.85 + 0.2 _ 3.94 + 0.2 _ 6.02 + 0.3 _ 0.4 + 0.1 0.15+0.1/-0.05 _ 1.63 + 0.2 _ 0.65 + 0.2 1.27 0.20+0.1/-0.05 FLP-8 Maximum Junction Temperature Storage Temperature Range Thermal Resistance, Junction to Ambient Note1) Surface Mounted on 1 1 FR4 Board, t 10sec. KU063N 03Q PIN CONNECTION (TOP VIEW) S S S G 1 8 D D D D 1 2 3 8 7 6 5 2 7 3 6 4 4 5 2010. 6. 17 Revision No : 0 1/4 KU063N03Q ELECTRICAL CHARACTERISTICS (Ta=25 CHARACTERISTIC Static Drain to Source Breakdown Voltage Drain Cut-off Current Gate to Source Leakage Current Gate to Source Threshold Voltage Drain to Source On Resistance Forward Transconductance Dynamic Input Capaclitance Ouput Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate to Source Charge Gate to Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Source to Drain Diode Ratings Source to Drain Forward Voltage Reverse Recovery Time Reverse Recovered Charge VSD trr Qrr VGS=0V, IS=16A IS=16A, dI/dt=100A/ s IS=16A, dI/dt=100A/ s 2% (Note2) VGS=10V VGS=4.5V Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDS=15V, VGS=10V ID=16A, RG=1.6 (Note2) VDS=15V, VGS=10V, ID=16A (Note2) f=1MHz VDS=15V, VGS=0V, f=1MHz (Note2) BVDSS IDSS IGSS Vth RDS(ON) gfs VGS=0V, ID=250 A VGS=0V, VDS=30V VGS= 20V, VDS=0V 30 1.0 (Note2) (Note2) (Note2) SYMBOL www..com ) UNLESS OTHERWISE NOTED TEST CONDITION MIN. TYP. MAX. UNIT 5.3 8.9 52 1 100 3.0 6.3 10.7 - V A nA V m S VDS=VGS, ID=250 A VGS=10V, ID=16A VGS=4.5V, ID=13A VDS=5V, ID=16A 1751 350 253 2.8 39.7 20.1 6.8 8.2 10.1 10.5 31.2 11.0 nC ns pF 0.8 22.5 9.5 1.2 - V ns nC Note2) Pulse Test : Pulse Width 300 , Duty Cycle 2010. 6. 17 Revision No : 0 2/4 KU063N03Q www..com Drain to Source On Resistance RDS(ON) () Fig1. ID - VDS 65 VGS=10V 5.0V 4.5V 4.0V 3.5V Fig2. RDS(on) - ID 10 8 6 4 2 0 Drain Current ID (A) 52 39 3.0V VGS=4.5V VGS=10V 26 13 0 0 0.5 1.0 1.5 2.0 2.5 3.0 0 13 26 39 52 65 Drain to Source Voltage VDS (V) Drain Current ID (A) Fig3. ID - VGS VDS=5V Fig4. RDS(ON) - Tj Normalized On Resistance RDS(ON) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -75 -50 -25 0 25 50 75 100 125 150 175 VGS=4.5V, ID=13A VGS=10V, ID=16A 65 Drain Current ID (A) 52 39 Tj=25 C 26 13 0 Tj=150 C Tj=-55 C 0 1 2 3 4 5 Gate - Source Voltage VGS (V) Junction Temperature Tj ( C ) Normalized Gate to Source Threshold Voltage Fig5. Vth - Tj 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -75 -50 -25 0 25 50 75 100 125 150 175 102 Fig6. IS - VSD Reverse Drain Current IS (A) VDS = VGS, ID = 250A Tj=150 C 101 Tj=25 C 100 Tj=-55 C 10-1 0.2 0.4 0.6 0.8 1.0 1.2 Junction Temperature Tj ( C ) Source to Drain Voltage VSD (V) 2010. 6. 17 Revision No : 0 3/4 KU063N03Q Fig7. RDS(ON) - VGS 20 ID=16A www..com Drain to Source On Resistance RDS(ON) (m) Fig8. C - VDS 104 f=1MHz Ciss 103 Coss 12 Tj=150 C Capacitance C (pF) 16 8 Tj=25 C 102 Crss 4 0 101 0 2 4 6 8 10 12 0 5 10 15 20 25 30 Gate to Source Voltage VGS (V) Drain to Source Voltage VDS (V) Fig9. Qg - VGS 10 Fig10. Safe Operation Area 102 Gate to Source Voltage VGS (V) VDS = 15V, ID = 16A Drain Current ID (A) 8 101 ( DS ON ) 100us LI M IT 1ms 10ms 100ms 6 100 R 4 2 10-1 VGS= 10V SINGLE PULSE TA= 25 C DC 0 0 15 30 45 60 75 10-2 10-2 10-1 100 101 102 Gate to Charge Qg (nC) Drain to Source Voltage VDS (V) Fig11. Transient Thermal Response Curve Normalized Effective Transient Thermal Resistance 101 100 0.5 0.2 10-1 0.1 0.05 0.02 0.01 PDM Single Pulse t1 t2 RthJA=60.5 C/W 10-2 10-3 10-4 10-3 10-2 10-1 100 101 102 103 Square Wave Pulse Duration (sec) 2010. 6. 17 Revision No : 0 4/4 |
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